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        1. 客戶管理及技術服務
        2. 可靠性試驗國際標準
        3. 申請服務 ?

          可靠性測試國際標準

          QRT半導體可靠性試驗標準目錄如下:

          JEDEC STANDARDS
          Document NumberContent
          JESD22-A100Cycled Temperature-Humidity-Bias Life Test
          JESD22-A101Steady State Temperature Humidity Bias Life Test
          JESD22-A102Accelerated Moisture Resistance - Unbiased Autoclave
          JESD22-A103High Temperature Storage Life
          JESD22-A104Temperature Cycling
          JESD22-A105Power and Temperature Cycling
          JESD22-A106Thermal Shock
          JESD22-A107Salt Atmosphere
          JESD22-A108Temperature, Bias, and Operating Life
          JESD22-A110Highly-Accelerated Temperature and Humidity Stress Test (HAST)
          JESD22-A113Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
          JESD22-A115Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
          JESD22-A117ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
          JESD22-A118Accelerated Moisture Resistance -Unbiased HAST
          JESD22-A119Low Temperature Storage Life
          JESD22-B101External Visual
          JESD22-B102Solderability
          JESD22-B103Vibration, Variable Frequency
          JESD22-B106Resistance to Solder Shock for Through-Hole Mounted Devices
          JESD22-B110Mechanical Shock - Compont and Subassembly
          JESD22-B111Board Level Drop Test Method of Components for Handheld Electronic Products
          JESD22-B113Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
          IPC/JEDEC J-STD-002Solderability Test for Component Leads, Terminations, Lugs, Terminals and Wires
          IPC/JEDEC J-STD-020Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
          ANSI/ESDA/JEDEC
          JS-001
          Human Body Model (HBM) - Component Level
          ANSI/ESDA/JEDEC
          JS-002
          Charged Device Model (CDM) – Device Level
          JEP122Failure Mechanisms and Models for Semiconductor Devices
          JESD47Stress-Test-Driven Qualification of Integrated Circuits
          JESD74Early Life Failure Rate Calculation Procedure for Semiconductor Components
          JESD78IC Latch-Up Test
          JESD226RF BIASED LIFE (RFBL) TEST METHOD


          AEC STANDARDS
          Document NumberContent
          AEC-Q100Stress Qualification For Integrated Circuits (with test methods)
          AEC-Q101Stress Test Qualification For Discrete Semiconductors
          AEC-Q200Stress Test Qualification For Passive Components (complete document with test methods)
          AEC-Q005Pb-Free Test Requirement
          AEC-Q006Qualification Requirements for Components using Copper Wire Interconnections
          IEC STANDARDS
          Document NumberContent
          IEC 60068Environmental testing
          IEC 60747Semiconductor devices
          IEC 60749Semiconductor devices-Mechanical and climate test methods
          IEC 60810Lamps for road vehicles – Performance requirements




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